The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Feb. 22, 2017
Kabushiki Kaisha Toshiba, Tokyo, JP;
Koh Hashimoto, Kanagawa, JP;
Makoto Sano, Kanagawa, JP;
Keiju Yamada, Kanagawa, JP;
Makoto Higaki, Tokyo, JP;
Akihiko Happoya, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to an embodiment, a wireless apparatus includes an interposer substrate, a semiconductor chip, a nonconductive layer, and a conductive film. The interposer substrate includes a conductive portion. The semiconductor chip is mounted on a component mounting face of the interposer substrate. The nonconductive layer is provided on the component mounting face to seal the chip. The conductive film is configured to cover a surface of the nonconductive layer and a side of the interposer substrate and is electrically connected to the conductive portion. The film has a first slot aperture. The conductive portion has a second slot aperture connecting to the first slot aperture. The first and second slot apertures serve as an integrated slot antenna. The antenna has first and second portions. The first portion includes a boundary between the first and second slot apertures and has a width larger than a width of the second portion.