The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9793121 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 17, 2017

Filed:

Jul. 01, 2016
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventor:

Yasuyuki Kawada, Tsukuba, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/04 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0485 (2013.01); H01L 29/1608 (2013.01); H01L 29/6606 (2013.01); H01L 29/872 (2013.01);
Abstract

A method of manufacturing a silicon carbide semiconductor device, having a silicon carbide semiconductor element substrate and a surface electrode film forming an ohmic contact between them. A first electrode film including nickel is formed on the substrate surface. A second electrode film with nickel silicide is formed on a first electrode film surface. The surface film is formed having the ohmic contact between the substrate surface and the first electrode film by annealing to cause silicon of the substrate and nickel of the first electrode film to react and convert the first electrode film to silicide. The first electrode film is formed with a thickness so that during annealing, an amount of carbon atoms is liberated from the substrate and diffuses toward the first electrode film, wherein the liberated amount is equal to or less than the amount of carbon atoms that the second electrode film is able to take in during annealing.


Find Patent Forward Citations

Kawada, Yasuyuki. (2017). Method of manufacturing silicon carbide semiconductor device (U.S. Patent No. 9793121). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9793121

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