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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9793103 B1

PDFFull Text
Date of Patent:
Oct. 17, 2017

Filed:

Jun. 11, 2013

Epoxy-based composition, adhesive film, dicing die-bonding film and semiconductor device

Applicant:

Lg Chem, Ltd., Seoul, KR;

Inventors:

Hyun Jee Yoo, Daejeon, KR;

Dong Han Kho, Daegu, KR;

Jang Soon Kim, Daejeon, KR;

Hyo Soon Park, Daejeon, KR;

Jong Wan Hong, Daejeon, KR;

Hyo Sook Joo, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:

Dentons US LLP

Primary Examiner:

Frank D Ducheneaux

Int. Cl.
CPC ...
H01L 21/02 (2006.01); C09J 5/06 (2006.01); C09J 163/00 (2006.01); C09J 133/14 (2006.01); C09J 133/02 (2006.01); C08K 5/13 (2006.01); C08L 61/06 (2006.01); C08L 61/12 (2006.01); C08L 61/20 (2006.01); C08L 63/00 (2006.01); C09J 133/06 (2006.01); C08L 33/06 (2006.01); C08G 59/62 (2006.01); H01L 21/683 (2006.01); C09J 7/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02002 (2013.01); C08G 59/621 (2013.01); C08K 5/13 (2013.01); C08L 33/066 (2013.01); C08L 61/06 (2013.01); C08L 61/12 (2013.01); C08L 61/20 (2013.01); C08L 63/00 (2013.01); C09J 133/066 (2013.01); C09J 133/068 (2013.01); C09J 163/00 (2013.01); C08L 33/068 (2013.01); C09J 5/06 (2013.01); C09J 7/02 (2013.01); C09J 2201/36 (2013.01); C09J 2201/60 (2013.01); C09J 2203/326 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H01L 21/6836 (2013.01); Y10T 428/269 (2015.01); Y10T 428/287 (2015.01); Y10T 428/2891 (2015.01); Y10T 428/31515 (2015.04);
Abstract

Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

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