The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Feb. 19, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventor:
Jong-hyun Seok, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 13/02 (2006.01); G11C 5/04 (2006.01); H05K 1/11 (2006.01); G11C 11/401 (2006.01); G11C 7/10 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01C 13/02 (2013.01); G11C 5/04 (2013.01); H05K 1/117 (2013.01); G11C 7/10 (2013.01); G11C 11/401 (2013.01); H05K 3/3415 (2013.01); H05K 2201/0385 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/10159 (2013.01);
Abstract
A semiconductor module includes a printed circuit board including an integrated circuit chip, connecting terminals at an edge of the printed circuit board, and signal lines respectively connecting electrical connection pads of the integrated circuit chip to the connecting terminals. The connecting terminals are plated using via-holes of the printed circuit board respectively connected to the signal lines.