The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Nov. 21, 2012
Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;
Ryou Ishibashi, Tokyo, JP;
Takashi Naitou, Tokyo, JP;
Motomune Kodama, Tokyo, JP;
Takuya Aoyagi, Tokyo, JP;
Tetsushi Hino, Tokyo, JP;
Motoo Aoyama, Tokyo, JP;
Tsuneyuki Hashimoto, Tokyo, JP;
Katsuhito Takahashi, Tokyo, JP;
Junichi Sakano, Tokyo, JP;
Hiroshi Nakano, Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Provided is a structure including a first member (); a second member () disposed opposite to the first member (); and a glass layer () disposed between the first member () and the second member () so as to bond the first member () and the second member (). A glass transition point of the glass layer () is lower than a temperature of the glass layer () under operation. In the glass layer (), at least either of ceramic and metallic particlesis dispersed. In a temperature region lower than the glass transition point of the glass layer (), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member () and the second member (). This allows thermal strain caused within the structure () to be reduced when the structure () is operated at a higher temperature than a room temperature.