The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Jul. 21, 2014
Applicants:

Manish Arora, Dublin, CA (US);

Nuwan Jayasena, Sunnyvale, CA (US);

Gabriel H. Loh, Bellevue, WA (US);

Michael J. Schulte, Austin, TX (US);

Srilatha Manne, Portland, OR (US);

Inventors:

Manish Arora, Dublin, CA (US);

Nuwan Jayasena, Sunnyvale, CA (US);

Gabriel H. Loh, Bellevue, WA (US);

Michael J. Schulte, Austin, TX (US);

Srilatha Manne, Portland, OR (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/00 (2006.01); G11C 7/04 (2006.01); G11C 13/00 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G11C 7/04 (2013.01); G06F 1/20 (2013.01); G06F 1/206 (2013.01); G11C 13/0004 (2013.01); G11C 13/0061 (2013.01);
Abstract

Various apparatus and methods using phase change materials are disclosed. In one aspect, a method of operating a computing device that has a first semiconductor chip with a first phase change material and a second semiconductor chip with a second phase change material is provided. The method includes determining if the first semiconductor chip phase change material has available thermal capacity. If the first semiconductor chip phase change material has available thermal capacity then the first semiconductor chip is instructed to operate in sprint mode. The first semiconductor chip is instructed to perform a first computing task while in sprint mode.


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