The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Dec. 29, 2015
Huawei Technologies Co., Ltd., Shenzhen, CN;
Xingchang Wei, Hangzhou, CN;
Huichun Yu, Shenzhen, CN;
Xiaobo Huang, Shenzhen, CN;
Xingyun Luo, Shenzhen, CN;
Huawei Technologies Co., Ltd., Shenzhen, CN;
Abstract
The present application provides an interposer, including an interposer substrate, at least one through silicon via, a first shield layer, a first insulation layer, a first cable layout layer, and at least one first bump. The interposer substrate includes an upper surface and a lower surface; the at least one through silicon via is buried in the interposer substrate and runs through the upper surface and the lower surface; the first shield layer is disposed on the upper surface of the interposer substrate and the first shield layer has electrical conductivity; the first insulation layer is disposed at the first shield layer; the first cable layout layer is disposed at the first insulation layer and is electrically connected to the at least one through silicon via.