The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Sep. 30, 2015
Applicant:

Integrated Device Technology, Inc., San Jose, CA (US);

Inventors:

James Bryan Northcutt, Lehigh Acres, FL (US);

Stephen Amar Tibbitts, Spanaway, WA (US);

Robert A. Gubser, Arlington, WA (US);

Bruce Edward Clark, Puyallup, WA (US);

John William Fallisgaard, Lake Forest Park, WA (US);

Kenneth Astrof, Edmonds, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/3187 (2006.01); G01R 31/28 (2006.01); H03B 5/32 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2884 (2013.01); G01R 31/282 (2013.01); G01R 31/2836 (2013.01); G01R 31/2853 (2013.01); H03B 5/32 (2013.01);
Abstract

Packaged integrated circuit devices include an oscillator circuit having a resonator (e.g., quartz crystal, MEMs, etc.) associated therewith, which is configured to generate a periodic reference signal. A built-in self-test (BIST) circuit is provided, which is selectively electrically coupled to first and second terminals of the resonator during an operation by the BIST circuit to test at least one performance characteristic of the resonator, such as at least one failure mode. These test operations may occur during a built-in self-test time interval when the oscillator circuit is at least partially disabled. In this manner, built-in self-test circuitry may be utilized to provide an efficient means of testing a resonating element/structure using circuitry that is integrated within an oscillator chip and within a wafer-level chip-scale package (WLCSP) containing the resonator.


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