The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Jan. 20, 2014
Hitachi Automotive System, Ltd., Hitachinaka-shi, Ibaraki, JP;
Shinobu Tashiro, Hitachinaka, JP;
Noboru Tokuyasu, Hitachinaka, JP;
Tsutomu Kono, Tokyo, JP;
Takeshi Morino, Hitachinaka, JP;
Tsubasa Watanabe, Tokyo, JP;
HITACHI AUTOMOTIVE SYSTEMS, LTD., Ibaraki, JP;
Abstract
In order to provide a method of manufacturing a thermal type flowmeter that is capable of reducing deformation of a semiconductor chip, which is caused by molding, a method of manufacturing a thermal type flowmeter is provided that includes a circuit package of a resin-molded semiconductor chip. The method includes resin-molding the semiconductor chip in a state in which a mold is pressed against a heat transfer surface that is provided on a surface of the semiconductor chip and a pressed surface that is set on the surface of the semiconductor chip at a position separate from the heat transfer surface.