The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

May. 12, 2015
Applicant:

Bourbaki 13, Inc., Seattle, WA (US);

Inventors:

Robert Bismuth, Seattle, WA (US);

William D. Orner, Mountain View, CA (US);

Jacob Rapoport, Seattle, WA (US);

Amit Rohatgi, Los Altos, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/25 (2006.01); A61B 5/107 (2006.01); G06T 7/00 (2017.01); A41H 1/02 (2006.01); A61B 5/00 (2006.01); A41H 3/04 (2006.01);
U.S. Cl.
CPC ...
G01B 11/254 (2013.01); A61B 5/1075 (2013.01); A61B 5/1077 (2013.01); A61B 5/1079 (2013.01); G01B 11/2513 (2013.01); G06T 7/0057 (2013.01); G06T 7/0065 (2013.01); A41H 1/02 (2013.01); A41H 3/04 (2013.01); A61B 5/6898 (2013.01); A61B 2503/40 (2013.01);
Abstract

Embodiments of a shape measurement system and related methods are disclosed. In some embodiments, the system places a two-dimensional initial pattern, which can be implemented as a standalone molding or can be attached to a light source or printed on an outfit, onto a surface of a three-dimensional object. The system captures a transformed version of the initial pattern in two dimensions that is distorted due to the varying depth of the surface. The system then analyzes the transformed pattern and derives three-dimensional information regarding the target object. The analysis, which can incorporate a calibration process, can rely on the projection nature of the light source, the isomorphism/non-isomorphism of the initial pattern, and other factors.


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