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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9791119 B1

PDFFull Text
Date of Patent:
Oct. 17, 2017

Filed:

Jan. 06, 2016

Light emitting module and head lamp including the same

Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Nam Seok Oh, Seoul, KR;

Yun Min Cho, Seoul, KR;

Jong Woo Lee, Seoul, KR;

Assignee:

LG INNOTEK CO., LTD., Seoul, KR;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Cuong B Nguyen

Int. Cl.
CPC ...
H01L 27/15 (2006.01); F21S 8/10 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01); F21V 9/16 (2006.01); H05K 3/28 (2006.01); F21V 3/04 (2006.01); F21V 7/22 (2006.01); F21V 13/02 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21S 48/1159 (2013.01); F21S 48/115 (2013.01); F21S 48/1154 (2013.01); F21S 48/12 (2013.01); F21S 48/1225 (2013.01); F21S 48/13 (2013.01); F21S 48/215 (2013.01); F21S 48/2218 (2013.01); H01L 27/153 (2013.01); H05K 1/05 (2013.01); H05K 1/183 (2013.01); F21V 3/0463 (2013.01); F21V 7/22 (2013.01); F21V 9/16 (2013.01); F21V 13/02 (2013.01); F21Y 2115/10 (2016.08); H01L 25/0753 (2013.01); H01L 33/58 (2013.01); H01L 2224/48091 (2013.01); H05K 3/284 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/10106 (2013.01);
Abstract

Disclosed is a light emitting module including a light emitting device package having a circuit board having a cavity, an insulation substrate arranged in the cavity, with a conductive pattern formed thereon, and at least one light emitting device disposed on the insulation substrate, with being electrically connected with the conductive pattern; and a glass cover located on the light emitting device package, with lateral surfaces, a top surface and an open bottom surface, wherein the light emitting device package and the circuit board are electrically connected with each other.

Find Patent Forward Citations

Oh, Nam. (2017). Light emitting module and head lamp including the same (U.S. Patent No. 9791119). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9791119

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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