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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9790405 B1

PDFFull Text
Date of Patent:
Oct. 17, 2017

Filed:

Feb. 27, 2015

Photocurable adhesive composition

Applicant:

Threebond Fine Chemical Co., Ltd., Sagamihara-shi, Kanagawa, JP;

Inventors:

Takashi Nemoto, Sagamihara, JP;

Yoshihide Arai, Sagamihara, JP;

Kenichi Horie, Sagamihara, JP;

Assignee:

Threebond Fine Chemical Co., Ltd., Kanagawa, JP;

Attorney:

Norris McLaughlin & Marcus, P.A.

Primary Examiner:

Ruiyun Zhang

Int. Cl.
CPC ...
B05D 5/06 (2006.01); C09J 7/00 (2006.01); C08G 18/67 (2006.01); C08G 18/75 (2006.01); C09J 171/00 (2006.01); C09J 175/16 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); C08L 71/00 (2006.01); C08L 75/16 (2006.01); G02F 1/1333 (2006.01); C09J 175/14 (2006.01);
U.S. Cl.
CPC ...
C09J 7/00 (2013.01); B32B 37/1284 (2013.01); B32B 37/18 (2013.01); C08G 18/672 (2013.01); C08G 18/755 (2013.01); C09J 171/00 (2013.01); C09J 175/16 (2013.01); B32B 2037/1253 (2013.01); B32B 2457/202 (2013.01); C08G 2650/56 (2013.01); C08L 71/00 (2013.01); C08L 75/16 (2013.01); C09J 175/14 (2013.01); C09J 2203/318 (2013.01); C09J 2471/00 (2013.01); C09J 2475/00 (2013.01); G02F 1/133308 (2013.01); G02F 2001/13332 (2013.01); G02F 2001/133325 (2013.01); G02F 2202/28 (2013.01); Y10T 428/1077 (2015.01);
Abstract

Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.

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