The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Jun. 20, 2014
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Julen De Mendizabal Zalaikin, Barcelona, ES;
Elisabeth Torres Cano, Barcelona, ES;
Dennis Bankmann, Duesseldorf, DE;
Roberto Pela, Tarragona, ES;
Sandra Niembro, Barcelona, ES;
Vincent Leon, Nicole, FR;
Henkel AG & Co. KGaA, Duesseldorf, DE;
Abstract
A radiation curable adhesive comprising (i) (meth)acrylic monomer(s) and/or oligomer(s), wherein said (meth)acrylic monomers or oligomers comprise 5 to 50 wt % of esters of (meth)acrylic acid with polyetherpolyols having the formula HO—((CH)—O)—X wherein m=2, 3 or 4; n=2 to 50; X=H, linear, branched or aromatic C1 to C12-alkyl, the ester having a molecular weight from 150 to 2000 g/mol; (ii) non-reactive (co)polymer(s) based on unsaturated monomers, wherein said unsaturated monomers are selected from vinyl esters, (meth)acrylate esters and C2 to C8 unsaturated olefins, the (co)polymer having a molecular weight from 5000 g/mol to 500000 g/mol, such adhesive can form a solid adhesive layer after being cross-linked by radiation, the layer, has a non tacky surface but can be adhesively bonded under pressure to a second layer of the adhesive.