The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Nov. 07, 2014
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Arnd Kaelberer, Schlierbach, DE;

Jochen Reinmuth, Reutlingen, DE;

Assignee:

ROBERT BOSCH GMBH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 15/00 (2006.01); G01C 19/00 (2013.01); B81B 7/00 (2006.01); G01P 15/08 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0048 (2013.01); B81C 1/00238 (2013.01); G01P 15/0802 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2207/012 (2013.01); B81B 2207/096 (2013.01); B81C 2203/0792 (2013.01); G01P 2015/0882 (2013.01);
Abstract

A micromechanical sensor device includes an evaluation circuit formed in a first substrate, and an MEMS structure which is situated in a cavity delimited by a second substrate and a third substrate, the MEMS structure and the second substrate being situated on top of each other, the MEMS structure being functionally connected to the evaluation circuit via a contact area, the contact area between the MEMS structure and the first substrate being situated essentially centrally on the second substrate and essentially centrally on the first substrate and has an essentially punctiform configuration, proceeding radially from the contact area, a clearance being formed between the first substrate and the second substrate.


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