The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Feb. 26, 2015
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Hiroyuki Tsuchiya, Suwa, JP;
Yasuhide Matsuo, Matsumoto, JP;
Kenji Otsuka, Chino, JP;
Minehiro Imamura, Chino, JP;
Tomohiro Hayashi, Matsumoto, JP;
Kei Tadachi, Fujimi-machi, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/15 (2006.01); B41J 2/16 (2006.01); C09J 183/04 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1632 (2013.01); B41J 2/1612 (2013.01); B41J 2/1623 (2013.01); B41J 2/1626 (2013.01); C09J 183/04 (2013.01); C08G 77/80 (2013.01);
Abstract
A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.