The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

May. 25, 2016
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masahisa Watanabe, Yokohama, JP;

Jun Yamamuro, Yokohama, JP;

Kazuhiro Asai, Kawasaki, JP;

Keiji Matsumoto, Fukushima, JP;

Koji Sasaki, Nagareyama, JP;

Kunihito Uohashi, Yokohama, JP;

Ryotaro Murakami, Yokohama, JP;

Tomohiko Nakano, Kawasaki, JP;

Keiji Edamatsu, Kawasaki, JP;

Haruka Nakada, Kawasaki, JP;

Kenji Fujii, Yokohama, JP;

Seiichiro Yaginuma, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1628 (2013.01); B41J 2/1404 (2013.01); B41J 2/1603 (2013.01); B41J 2/1631 (2013.01);
Abstract

A method for manufacturing a liquid ejection head includes the steps of: preparing a substrate including an energy-generating element disposed on a first surface of the substrate and a supply path for liquid; disposing a dry film on the first surface of the substrate in such a manner that the dry film partially enters the supply path; etching the dry film from a side of the dry film facing the first surface of the substrate so that the dry film has an etched surface substantially in parallel with the first surface and covers the supply path; forming a resin layer to be a flow path member on the dry film covering the supply path; and removing the dry film covering the supply path.


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