The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Oct. 04, 2010
Applicants:

Hiroyuki Usui, Tochigi, JP;

Yoshihisa Shinya, Tochigi, JP;

Yasumi Endo, Tochigi, JP;

Inventors:

Hiroyuki Usui, Tochigi, JP;

Yoshihisa Shinya, Tochigi, JP;

Yasumi Endo, Tochigi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 41/00 (2006.01); B32B 37/12 (2006.01); H01J 37/32 (2006.01); B29C 65/14 (2006.01); B29C 65/48 (2006.01); B29C 65/52 (2006.01); B29C 65/00 (2006.01); G02F 1/13 (2006.01); B29C 65/78 (2006.01); G02F 1/1341 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1284 (2013.01); B29C 65/1435 (2013.01); B29C 65/1448 (2013.01); B29C 65/1483 (2013.01); B29C 65/4845 (2013.01); B29C 65/524 (2013.01); B29C 66/324 (2013.01); B29C 66/342 (2013.01); B29C 66/343 (2013.01); B29C 66/3452 (2013.01); B29C 66/45 (2013.01); B29C 66/73366 (2013.01); B29C 66/7465 (2013.01); B29C 66/81267 (2013.01); B29C 66/8322 (2013.01); G02F 1/1303 (2013.01); H01J 37/32321 (2013.01); B29C 65/1454 (2013.01); B29C 65/1464 (2013.01); B29C 65/7847 (2013.01); B29L 2031/3475 (2013.01); B32B 2310/0831 (2013.01); B32B 2457/202 (2013.01); G02F 1/1341 (2013.01);
Abstract

A bonding device for charging a liquid material into a space between plate-shaped members for bonding them together in situ, in which the liquid material may be prevented from exuding from the space between the plate-shaped members. The bonding device includes pair retaining base members for retaining the pair plate-shaped members facing each other, and a retaining base member movement unit for causing movement of the retaining base members towards and away from each other. The bonding device also includes an illumination unit that illuminates curing light to a photo-curable liquid material charged between the pair plate-shaped members held by the pair retaining base members, and a sensor that detects the wetting spreading state of the liquid material charged between the pair plate-shaped members.


Find Patent Forward Citations

Usui, Hiroyuki. (2017). Bonding device and method for producing plate-shaped bonded assembly (U.S. Patent No. 9789674). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9789674

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…