The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Feb. 27, 2013
Applicants:
Takeshi Kumazawa, Aichi, JP;
Kiyoto Sekine, Aichi, JP;
Ayumi Tsujino, Aichi, JP;
Inventors:
Assignee:
MINO CERAMIC CO., LTD., Mizunami-shi, Gifu, JP;
Primary Examiner:
Int. Cl.
CPC ...
F41H 5/04 (2006.01); B32B 15/04 (2006.01); B32B 15/20 (2006.01); B32B 18/00 (2006.01); B32B 37/06 (2006.01); C04B 35/563 (2006.01); C04B 35/645 (2006.01); C04B 37/00 (2006.01);
U.S. Cl.
CPC ...
B32B 37/06 (2013.01); C04B 35/563 (2013.01); C04B 35/645 (2013.01); C04B 37/006 (2013.01); F41H 5/0421 (2013.01); C04B 2235/3821 (2013.01); C04B 2235/3895 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/656 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/72 (2013.01); C04B 2235/722 (2013.01); C04B 2235/77 (2013.01); C04B 2235/963 (2013.01); C04B 2237/121 (2013.01); C04B 2237/124 (2013.01); C04B 2237/125 (2013.01); C04B 2237/341 (2013.01); C04B 2237/343 (2013.01); C04B 2237/36 (2013.01); C04B 2237/365 (2013.01); C04B 2237/592 (2013.01); C04B 2237/64 (2013.01); C04B 2237/704 (2013.01); C04B 2237/708 (2013.01);
Abstract
A shock absorbing memberhaving a ceramic bonded bodyhaving: a plurality of first sheet-like memberseach having a ceramic containing 60 mass % or more of boron carbide and each having a thickness of 0.1 to 50 mm; and a bonding layer arranged between the first sheet-like membersadjacent to each other, the bonding layer bonding surfaces to be bonded facing each other of the first sheet-like members adjacent to each other, wherein the bonding layer has a bonding material containing at least one metal selected from the group consisting of aluminum, copper, silver, and gold.