The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Mar. 05, 2012
Katsuki Furuta, Hachioji, JP;
Hiroyuki Matsuda, Sagamihara, JP;
Katsuki Furuta, Hachioji, JP;
Hiroyuki Matsuda, Sagamihara, JP;
KONICA MINOLTA, INC., Tokyo, JP;
Abstract
A resin amount for forming each first-stage resin layer portion (a first-stage resin replica portion)in a first process is defined to be greater than a resin amount for forming each second-stage resin layer portion (a second-stage resin replica portion)in a second process. Therefore, at a boundary between the first-stage resin layer portionand the second-stage resin layer portion, a joint portionat which resin overlaps is formed, whereby occurrence of an undercut shape can be avoided. Therefore, in a molding process using a sub-master dieand a sub-sub-master dieobtained from the sub-master die, occurrence of an undesired shape can be avoided, whereby mold release resistance can be reduced or eliminated.