The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Jan. 30, 2013
Mitsubishi Heavy Industries Plastic Technology Co., Ltd., Nagoya-shi, Aichi, JP;
Masaaki Ikarashi, Nagoya, JP;
Mamoru Kawasaki, Nagoya, JP;
Takehiro Irie, Nagoya, JP;
Toshihiko Kariya, Nagoya, JP;
MITSUBISHI HEAV INDUSTRIES PLASTIC TECHNOLOGY CO., LTD., Nagoya-shi, Aichi, JP;
Abstract
A mold-clamping device includes a fixed mold plate including a fixed mold; a movable mold plate including a movable mold; a hydraulic cylinder allowing the movable mold plate to approach or be separated from the fixed mold plate; a hydraulic pressure supply source supplying a hydraulic fluid to the hydraulic cylinder; and a control unit performing driving control on the hydraulic pressure supply source. The control unit includes a flow rate decrease control unit for deceleration for decreasing a flow rate of the hydraulic fluid according to a deceleration gradient set in advance when a movement of the movable mold plate is decelerated according to the deceleration gradient, and a flow rate increase control unit for controlling the flow rate of the hydraulic fluid to increase when the flow rate of the hydraulic fluid is decreased according to the deceleration gradient by the flow rate decrease control unit.