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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9789637 B1

PDFFull Text
Date of Patent:
Oct. 17, 2017

Filed:

Jul. 10, 2013

Electronic device and method for manufacturing the same

Applicant:

Denso Corporation, Kariya, Aichi-pref., JP;

Inventors:

Ryosuke Izumi, Nagoya, JP;

Takashige Saito, Ama, JP;

Hiroyuki Okuhira, Kariya, JP;

Yuuichi Ikuno, Obu, JP;

Kouji Yamamoto, Nakata-gun, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

James Wu

Assistant Examiner:

Michael Matey

Int. Cl.
CPC ...
B29C 45/16 (2006.01); H05K 5/00 (2006.01); H05K 5/06 (2006.01); B29C 43/18 (2006.01); G01L 19/14 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); B29C 45/14 (2006.01); B29C 45/02 (2006.01); B29K 101/10 (2006.01); B29K 101/12 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 45/16 (2013.01); B29C 43/18 (2013.01); B29C 45/1657 (2013.01); B29C 45/1671 (2013.01); G01L 19/141 (2013.01); H01L 21/565 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H05K 5/0095 (2013.01); H05K 5/065 (2013.01); B29C 45/02 (2013.01); B29C 45/14639 (2013.01); B29C 2045/1664 (2013.01); B29K 2101/10 (2013.01); B29K 2101/12 (2013.01); B29L 2031/3481 (2013.01); H01L 23/3107 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01);
Abstract

An electronic device includes a first molded product integrated with an electronic component, and a second molded product secondarily molded outside of the first molded product. The first molded product includes a thermosetting resin, and a first additive contained in the thermosetting resin, and the second molded product includes a thermoplastic resin, and a second additive contained in the thermoplastic resin and having a reactive group that chemically bonds with the first additive. At an interface between the first molded product and the second molded product, the first additive and the second additive are joined to each other by one or more joint actions selected from covalent bonding, ionic bonding, hydrogen bonding, intermolecular forces, dispersion force, and diffusion. As a result, the adhesion between both the molded products can be firmly secured through the molding technique such as the transfer molding method or the compression molding method.

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