The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Apr. 30, 2010
Mark W. Broadley, Downingtown, PA (US);
James Alan Sago, Solon, OH (US);
Hao Chen, Ann Arbor, MI (US);
Edward J. Schweitzer, Cannonsburg, PA (US);
John Eckert, Boyertown, PA (US);
Jeffrey M. Farina, Zionsville, PA (US);
Mark W. Broadley, Downingtown, PA (US);
James Alan Sago, Solon, OH (US);
Hao Chen, Ann Arbor, MI (US);
Edward J. Schweitzer, Cannonsburg, PA (US);
John Eckert, Boyertown, PA (US);
Jeffrey M. Farina, Zionsville, PA (US);
Accellent Inc., Wilmington, MA (US);
Abstract
A method of pressure forming a brown part from metal and/or ceramic particle feedstocks includes: introducing into a mold cavity or extruder a first feedstock and one or more additional feedstocks or a green or brown state insert made from a feedstock, wherein the different feedstocks correspond to the different portions of the part; pressurizing the mold cavity or extruder to produce a preform having a plurality of portions corresponding to the first and one or more additional feedstocks, and debinding the preform. Micro voids and interstitial paths from the interior of the preform part to the exterior allow the escape of decomposing or subliming backbone component substantially without creating macro voids due to internal pressure. The large brown preform may then be sintered and subsequently thermomechanically processed to produce a net wrought microstructure and properties that are substantially free the interstitial spaces.