The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Jun. 07, 2013
Applicant:

Hangzhou Hpwinner Opto Corporation, Hangzhou, Zhejiang, CN;

Inventors:

Kai Chen, Zhejiang, CN;

Jianming Huang, Zhejiang, CN;

Huali Lu, Zhejiang, CN;

Assignee:

HANGZHOU HPWINNER OPTO CORPORATION, Hangzhou, Zhejiang Province, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 5/06 (2006.01); F21V 31/04 (2006.01); F21V 27/02 (2006.01); F16B 37/00 (2006.01); H02G 15/013 (2006.01); H05K 3/10 (2006.01); F21V 29/70 (2015.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H05K 5/062 (2013.01); F16B 37/00 (2013.01); F21V 27/02 (2013.01); F21V 31/04 (2013.01); H02G 15/013 (2013.01); H05K 3/103 (2013.01); F21V 29/70 (2015.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); Y10T 29/49124 (2015.01);
Abstract

A sealing process of LED modules includes a waterproof wire put through a wire-through hole of a heat sink to be connected with a positive-negative solder joints on a PCB board, which are subjected to glue sealing treatment. A waterproof sealing process is operated between the waterproof wire and wire-through hole. The PCB board is fixed on the heat sink. One sealing ring is placed into a groove. A ring of liquid silica gel is evenly applied along the other groove. The heat sink installed with the PCB board and the waterproof wire are inversely buckled on the lens set which is fixed with the solid silica gel ring and liquid silica gel. At least two waterproof sealing rings are used to isolate an LED chip from the outside so as to prevent all water vapor or other harmful gases from corroding the chip and the PCB.


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