The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Dec. 12, 2012
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Seol Hee Lim, Seoul, KR;
Yun Kyoung Jo, Seoul, KR;
Ae Rim Kim, Seoul, KR;
Sai Ran Eom, Seoul, KR;
Chang Hwa Park, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 3/30 (2006.01); H05K 1/11 (2006.01); H05K 3/24 (2006.01); C25D 3/12 (2006.01); C25D 3/16 (2006.01); C25D 3/48 (2006.01); C25D 3/50 (2006.01); C25D 3/56 (2006.01); C25D 3/62 (2006.01); C25D 5/12 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/18 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/301 (2013.01); C25D 3/12 (2013.01); C25D 3/16 (2013.01); C25D 3/48 (2013.01); C25D 3/50 (2013.01); C25D 3/562 (2013.01); C25D 3/567 (2013.01); C25D 3/62 (2013.01); C25D 5/12 (2013.01); H05K 1/092 (2013.01); H05K 1/117 (2013.01); H05K 1/18 (2013.01); H05K 3/185 (2013.01); H05K 3/244 (2013.01); C23C 18/1653 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10909 (2013.01); H05K 2203/049 (2013.01); H05K 2203/1572 (2013.01); Y10T 29/49128 (2015.01);
Abstract
The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.