The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Jul. 25, 2012
Applicant:
Masatsugu Iiyama, Satsumasendai, JP;
Inventor:
Masatsugu Iiyama, Satsumasendai, JP;
Assignee:
KYOCERA CORPORATION, Kyoto-Shi, Kyoto, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 23/13 (2013.01); H01L 23/49805 (2013.01); H05K 3/3442 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H05K 2201/09181 (2013.01); H05K 2201/10727 (2013.01); Y02P 70/613 (2015.11);
Abstract
A wiring substrate comprises an insulating substrate and an external electrode on the insulating substrate. The insulating substrate comprises a lateral surface comprising a cutout. The cutout extends to a lower surface of the insulating substrate. The external electrode extends from an inner surface of the cutout to the lower surface of the insulating substrate. The insulating substrate comprises a protrusion at a lower end portion of the inner surface of the cutout. The protrusion protrudes from the inner surface of the cutout toward the lateral surface of the insulating substrate.