The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Jun. 11, 2015
Applicant:
Tyco Electronics Amp Korea Ltd, Gyungsangbuk-do, KR;
Inventors:
Yang Yoon Choi, Gyungsangbuk-Do, KR;
Ok Ky Beak, Gyungsangbuk-Do, KR;
Assignee:
Tyco Electronics AMP Korea Ltd., Gyungsangbuk-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); H05K 3/38 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/28 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 1/053 (2013.01); H05K 1/0201 (2013.01); H05K 1/0278 (2013.01); H05K 1/09 (2013.01); H05K 3/285 (2013.01); H05K 3/421 (2013.01); H05K 3/425 (2013.01); H05K 3/429 (2013.01); H05K 3/4608 (2013.01); H05K 1/0207 (2013.01); H05K 3/06 (2013.01); H05K 2201/0323 (2013.01); H05K 2203/072 (2013.01); H05K 2203/073 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A printed circuit board has a core made of an aluminum material; a bonding member positioned on opposite surfaces of the core; a base layer bonded to the opposite surface of the core through the bonding member; a receiving hole extending through the core, the bonding member, and the base layer; a zinc substitution layer positioned on a surface of the base layer and a portion of the base layer exposed on an inner surface of the receiving hole; and a plating layer positioned on the zinc substitution layer, and having a circuit pattern.