The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

May. 29, 2015
Applicant:

Trane International Inc., Piscataway, NJ (US);

Inventors:

Steven K. Klingemann, West Salem, WI (US);

Alejandro Jimenez, Maple Grove, MN (US);

Assignee:

Trane International Inc., Piscataway, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0215 (2013.01); G02F 1/133308 (2013.01); H05K 1/144 (2013.01); H05K 3/368 (2013.01); G02F 2001/133334 (2013.01); H05K 2201/042 (2013.01);
Abstract

Techniques and arrangements for forming ground bonds between a plurality of components are provided. In one form, a grounding arrangement includes a first circuit board including a first ground plane and a flange member electrically coupled to the first ground plane. The arrangement also includes a second circuit board including a second ground plane, and a polymeric member including an electrically conductive coating. The polymeric member forms a bond between the first ground plane, the flange member, and the second ground plane. In one particular but non-limiting aspect of this form, the grounding arrangement is utilized in a human machine interface having a liquid crystal display. Further embodiments, forms, objects, features, advantages, aspects, and benefits shall become apparent from the description and drawings.


Find Patent Forward Citations

Klingemann, Steven. (2017). Techniques and arrangements for multiple component grounding (U.S. Patent No. 9788412). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9788412

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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