The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Aug. 12, 2014
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Tomohiko Uchiyama, Tokyo, JP;
Yasuhiro Murai, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 21/08 (2006.01); H01F 27/24 (2006.01); H05K 1/02 (2006.01); H01F 27/28 (2006.01); H05K 7/14 (2006.01); H05K 3/28 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H01F 27/2804 (2013.01); H05K 3/28 (2013.01); H05K 7/1432 (2013.01); H01F 2027/2819 (2013.01); H05K 1/165 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/086 (2013.01); H05K 2201/09063 (2013.01);
Abstract
In the printed circuit boardin the power supply device, cover layers Cand Care formed on a surface other than the connection areasA' andB′ within a coil pattern EC, which corresponds to a surface-shaped exposure area exposed to the outside so that the size of the surface-shaped exposure area to which the conductive pattern E is exposed is adjusted, so that an effect, which restrains a conductor from being damaged, especially at a time of carrying the printed circuit boardwhile maintaining a heat radiating property of the conductor, is achieved.