The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Jan. 07, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Young-Kwan Lee, Changwon, KR;
Yul-Kyo Chung, Yongin, KR;
Seung-Eun Lee, Seongnam, KR;
Ki-Jung Sung, Seoul, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/42 (2013.01);
Abstract
A circuit board includes an insulating material; and a heat-transfer structure comprising a plurality of heat-dissipating members and inserted in the insulating material, wherein the plurality of heat-dissipating members each includes a metal wire; and an insulating part disposed on an outer circumferential surface of the metal wire excluding a top surface and a bottom surface of the metal wire.