The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Mar. 31, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Logan M. Ames, Palo Alto, CA (US);

Michael M. Li, San Jose, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/21 (2014.01); B23K 26/24 (2014.01); B23K 26/32 (2014.01); B23K 103/18 (2006.01); B32B 3/24 (2006.01); B32B 7/02 (2006.01); B32B 7/04 (2006.01); B32B 3/02 (2006.01); B32B 37/06 (2006.01); B32B 38/00 (2006.01); H04B 1/3888 (2015.01); H04M 1/725 (2006.01); H05K 5/00 (2006.01); B23K 26/00 (2014.01); B32B 37/14 (2006.01); B32B 37/18 (2006.01); B32B 37/12 (2006.01); B23K 26/57 (2014.01); B23K 26/10 (2006.01); B23K 26/26 (2014.01); B23K 26/40 (2014.01); H05K 5/03 (2006.01); B29C 65/16 (2006.01); B29C 65/00 (2006.01); B32B 3/26 (2006.01); B23K 26/60 (2014.01); B23K 103/00 (2006.01); B23K 103/08 (2006.01); B23K 26/324 (2014.01); B23K 101/36 (2006.01); B32B 7/00 (2006.01); H04M 1/02 (2006.01); G06F 1/16 (2006.01); B29L 31/34 (2006.01); H05K 5/06 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
H04B 1/3888 (2013.01); B23K 26/0063 (2013.01); B23K 26/10 (2013.01); B23K 26/26 (2013.01); B23K 26/32 (2013.01); B23K 26/40 (2013.01); B23K 26/57 (2015.10); B29C 65/1638 (2013.01); B29C 66/242 (2013.01); B29C 66/303 (2013.01); B29C 66/30325 (2013.01); B32B 37/06 (2013.01); B32B 37/12 (2013.01); B32B 37/142 (2013.01); B32B 37/18 (2013.01); B32B 38/0008 (2013.01); H04M 1/72519 (2013.01); H05K 5/0004 (2013.01); B23K 26/324 (2013.01); B23K 26/60 (2015.10); B23K 2201/36 (2013.01); B23K 2203/08 (2013.01); B23K 2203/18 (2013.01); B23K 2203/42 (2015.10); B23K 2203/50 (2015.10); B23K 2203/52 (2015.10); B23K 2203/54 (2015.10); B29C 65/16 (2013.01); B29C 65/1629 (2013.01); B29C 65/1654 (2013.01); B29C 66/02 (2013.01); B29C 66/114 (2013.01); B29C 66/1142 (2013.01); B29C 66/1162 (2013.01); B29C 66/24221 (2013.01); B29C 66/70 (2013.01); B29C 66/72 (2013.01); B29C 66/73116 (2013.01); B29C 66/73361 (2013.01); B29C 66/73365 (2013.01); B29L 2031/3481 (2013.01); B32B 3/02 (2013.01); B32B 3/266 (2013.01); B32B 7/005 (2013.01); B32B 7/02 (2013.01); B32B 7/04 (2013.01); B32B 7/045 (2013.01); B32B 2307/412 (2013.01); B32B 2310/0843 (2013.01); B32B 2457/00 (2013.01); B32B 2457/20 (2013.01); C04B 2237/76 (2013.01); C04B 2237/78 (2013.01); G06F 1/1626 (2013.01); G06F 1/1637 (2013.01); H04M 1/026 (2013.01); H04M 1/0249 (2013.01); H04M 1/0264 (2013.01); H04M 1/0266 (2013.01); H05K 5/03 (2013.01); H05K 5/04 (2013.01); H05K 5/066 (2013.01); Y10T 428/13 (2015.01); Y10T 428/24322 (2015.01); Y10T 428/24331 (2015.01); Y10T 428/24339 (2015.01); Y10T 428/24488 (2015.01); Y10T 428/24521 (2015.01); Y10T 428/24777 (2015.01);
Abstract

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.


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