The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Dec. 13, 2016
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Wei Liu, Irvine, CA (US);

Bipul Agarwal, Irvine, CA (US);

Richard Mark Puente, Westminster, MA (US);

Assignee:

SKYWORKS SOLUTIONS, INC., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04W 88/08 (2009.01); H03K 17/74 (2006.01); G05F 3/08 (2006.01); H01L 25/16 (2006.01); H01L 23/495 (2006.01); H01L 23/373 (2006.01); H01L 29/868 (2006.01); H01L 23/66 (2006.01); H02M 3/07 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H03K 17/74 (2013.01); G05F 3/08 (2013.01); H01L 23/3731 (2013.01); H01L 23/49503 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/49589 (2013.01); H01L 23/66 (2013.01); H01L 25/16 (2013.01); H01L 29/868 (2013.01); H02M 3/07 (2013.01); H01L 24/48 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2924/12031 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/3011 (2013.01); H04W 88/08 (2013.01);
Abstract

Apparatus and methods for PIN diode switches for radio frequency electronic systems are provided herein. In certain configurations, a packaged switch including a packaging substrate including a die paddle and a thermally conductive substrate attached to the die paddle, one or more PIN diode switches attached to the thermally conductive substrate, and a driver chip attached to the die paddle and configured to generate a plurality of bias voltages operable to control biasing of the one or more PIN diode switches. The driver chip includes a switching regulator configured to generate a first bias voltage of the plurality of bias voltages and a charge pump configured to generate a second bias voltage of the plurality of bias voltages.


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