The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Nov. 16, 2016
Applicant:

Alltop Electronics (Suzh Ou) Ltd., Taicang, JiangSu Province, CN;

Inventors:

Ya-Juan Gou, Taicang, CN;

Zhi-Qiang Rong, Taicang, CN;

Li-Ii Liang, Taicang, CN;

Mao-Jung Huang, New Taipei, TW;

Wang-I Yu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/6585 (2011.01); H01R 13/6592 (2011.01); H01R 12/53 (2011.01); H01R 24/60 (2011.01); H01R 13/6582 (2011.01); H01R 43/02 (2006.01); H01R 43/24 (2006.01); H01R 43/20 (2006.01); H01R 43/26 (2006.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 12/53 (2013.01); H01R 13/6582 (2013.01); H01R 24/60 (2013.01); H01R 43/0256 (2013.01); H01R 43/205 (2013.01); H01R 43/24 (2013.01); H01R 43/26 (2013.01); H01R 2107/00 (2013.01);
Abstract

A USB cable end connector and the method of making the same are disclosed. The cable end connector includes a first contact module, a second contact module, a central grounding unit sandwiched between the two contact modules, a shielding shell enclosing the first and the second contact modules; and a grounding means attached to the first and the second contact modules along a height direction of the connector. The grounding means includes an upper grounding pad and a lower grounding pad. The upper grounding pad and the lower grounding pad are assembled to a first and a second insulators of the contact modules along a height direction, respectively. The upper grounding pad is sandwiched between the first contact module and the shielding shell. The lower grounding pad is sandwiched between the second contact module and the shielding shell.


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