The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

May. 10, 2013
Applicants:

Uacj Corporation, Chiyoda-ku, Tokyo, JP;

Uacj Foil Corporation, Chuo-ku, Tokyo, JP;

Inventors:

Osamu Kato, Chiyoda-ku, JP;

Sohei Saito, Chiyoda-ku, JP;

Yukiou Honkawa, Chiyoda-ku, JP;

Mitsuyuki Wasamoto, Kusatsu, JP;

Tsugio Kataoka, Kusatsu, JP;

Satoshi Yamabe, Kusatsu, JP;

Assignees:

UACJ CORPORATION, Chuo-Ku, Tokyo, JP;

UACJ FOIL CORPORATION, Chuo-Ku, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/62 (2006.01); H01M 4/04 (2006.01); H01M 4/66 (2006.01); H01G 11/28 (2013.01); H01G 11/68 (2013.01); H01G 11/70 (2013.01); H01B 1/24 (2006.01); H01M 2/34 (2006.01); H01M 10/052 (2010.01);
U.S. Cl.
CPC ...
H01M 4/625 (2013.01); H01B 1/24 (2013.01); H01G 11/28 (2013.01); H01G 11/68 (2013.01); H01G 11/70 (2013.01); H01M 2/348 (2013.01); H01M 4/0404 (2013.01); H01M 4/0471 (2013.01); H01M 4/661 (2013.01); H01M 4/666 (2013.01); H01M 4/667 (2013.01); H01M 4/668 (2013.01); H01M 4/663 (2013.01); H01M 10/052 (2013.01); H01M 2200/106 (2013.01); Y02E 60/13 (2013.01);
Abstract

Current collector, an electrode structure, a non-aqueous electrolyte battery, and an electrical storage device having superior shut down function are provided. According to the present invention, a current collector having a resin layer on at least one side of a conductive substrate is provided. Here, thermoplastic resin particles substantially free of a conductive agent are dispersed in a thermosetting resin base material containing the conductive agent to structure the resin layer; a value of mass ratio given by (thermoplastic resin particles)/(conductive agent) is 0.3 to 1.5; and a value given by (average thickness of conductive agent)/(average thickness of thermoplastic resin particles) is 0.3 to 4.0.


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