The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Aug. 30, 2012
Applicants:

Amy A. Lefebvre, Pottstown, PA (US);

Gregory S. O'brien, Downingtown, PA (US);

Samuel Devisme, Rouen, FR;

Anthony Bonnet, Saint Laurent de Mure, FR;

Inventors:

Amy A. Lefebvre, Pottstown, PA (US);

Gregory S. O'Brien, Downingtown, PA (US);

Samuel Devisme, Rouen, FR;

Anthony Bonnet, Saint Laurent de Mure, FR;

Assignee:

Arkema Inc., King of Prussia, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/044 (2014.01); H01L 31/048 (2014.01); H01L 31/049 (2014.01); B32B 5/02 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0487 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/20 (2013.01); B32B 27/304 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); H01L 31/049 (2014.12); B32B 2307/712 (2013.01); B32B 2457/12 (2013.01); Y02E 10/50 (2013.01);
Abstract

The invention relates to a multi-layer weatherable film structure having an outer layer of a highly weatherable film, a layer having a high thermal deformation temperature, an optional tie layer, and a thin layer of polyolefin or polyamide. The highly weatherable film layer preferably is polyvinylidene fluoride. The polyolefin or polyamide layer is less than 500 microns in thickness, and preferably the whole film structure is less than 750 microns thick. The polyolefinjpolyamide side of the film structure can easily be adhered to many different substances—especially polyolefins and polyamides. This film can be used to provide a highly weatherable protective layer a substrate. One useful application for the film is in a photovoltaic module to protect the back side of the module from weathering and abrasion. The multi-layer film structure can be adhered to a typical polyolefin-based encapsulant layer and used as a backsheet encapsulant in a photovoltaic module.


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