The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Nov. 12, 2015
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Tetsuji Yamaguchi, Kanagawa, JP;

Kazunori Nagahata, Kanagawa, JP;

Toshihiro Miura, Kanagawa, JP;

Kaori Takimoto, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/30 (2006.01); H01L 27/146 (2006.01); H01L 21/74 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14634 (2013.01); H01L 21/743 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14647 (2013.01); H01L 27/14667 (2013.01); H01L 27/307 (2013.01);
Abstract

A solid-state image pickup unit including a pixel section having a plurality of unit pixels two-dimensionally arranged in a matrix formation, wherein a unit pixel includes a conductive region of a first conductivity type having a surface adjacent to a multilayer wiring layer, a charge accumulation region of a second conductivity type formed within the first conductive region, wherein the charge accumulation region is separated from the surface of the conductive region adjacent to the multilayer wiring layer by a separation section, and a contact disposed in the conductive region, the contact electrically connecting the charge accumulation region and an external wire of the multilayer wiring layer.


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