The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Sep. 02, 2016
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventors:

Ki Hong Lee, Gyeonggi-do, KR;

Duk Eui Lee, Seoul, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2017.01); H01L 27/11582 (2017.01); H01L 27/11556 (2017.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/31111 (2013.01); H01L 27/11556 (2013.01);
Abstract

The invention is related to a method for manufacturing a semiconductor device having a barrier pattern. The method includes alternately forming first sacrificial layers and insulating layers forming channel patterns penetrating the first sacrificial layers and the insulating layers, and forming a slit penetrating the first sacrificial layers and the insulating layers. In order to form the barrier pattern, the method also includes forming openings by removing the first sacrificial layers through the slit, and respectively forming conductive layers in the openings. The conductive layers include first barrier patterns having inclined inner surfaces and metal patterns in the first barrier patterns.


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