The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Jun. 20, 2016
Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventor:

Junichi Ariyoshi, Yokkaichi, JP;

Assignee:

SANDISK TECHNOLOGIES LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/167 (2006.01); H01L 27/11582 (2017.01); H01L 27/11556 (2017.01); H01L 29/417 (2006.01); H01L 21/265 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/26513 (2013.01); H01L 27/11556 (2013.01); H01L 29/167 (2013.01); H01L 29/41741 (2013.01); H01L 29/6656 (2013.01);
Abstract

Memory-opening semiconductor material portions and support opening fill structures can be simultaneously formed through a first alternating stack of first insulating layers and first sacrificial material layers. Dopant species that retard or prevent etching of the material of the support opening fill structures can be implanted into an upper portion of each support opening fill structure, while memory-opening semiconductor material portions are masked from implantation. After formation of a second alternating stack and second openings therethrough, the sacrificial material of the memory-opening semiconductor material portions is removed while the support opening fill structures is not removed. Damage to the first sacrificial material layers during formation of the staircase contact region and resulting leakage paths from word lines to the substrate through support pillar structures can be avoided or reduced by not removing the support opening fill structures.


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