The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Aug. 31, 2016
Applicant:

Advanced Optoelectronic Technology, Inc., Hsinchu Hsien, TW;

Inventors:

Hou-Te Lin, Hsinchu, TW;

Wen-Liang Tseng, Hsinchu, TW;

Lung-Hsin Chen, Hsinchu, TW;

Pin-Chuan Chen, Hsinchu, TW;

Hsin-Chiang Lin, Hsinchu, TW;

Chao-Hsiung Chang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 27/02 (2006.01); H01L 29/866 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/165 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 27/0248 (2013.01); H01L 29/866 (2013.01);
Abstract

A miniaturized LED package substrate allowing for the better installation of an electrostatic protection device includes an upper substrate, a lower substrate, and a circuit layer. The circuit layer is positioned between the upper substrate and the lower substrate and electrically connected to the upper substrate and the lower substrate. At least one cavity is defined at the lower substrate, and each of the at least one cavity passes through the lower substrate to expose a portion of the circuit layer.


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