The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Feb. 17, 2011
Takuya Aoyagi, Tsuchiura, JP;
Takashi Naito, Funabashi, JP;
Yuji Hashiba, Narita, JP;
Kei Yoshimura, Inzai, JP;
Shinichi Tachizono, Narita, JP;
Takuya Aoyagi, Tsuchiura, JP;
Takashi Naito, Funabashi, JP;
Yuji Hashiba, Narita, JP;
Kei Yoshimura, Inzai, JP;
Shinichi Tachizono, Narita, JP;
HITACHI, LTD., Tokyo, JP;
HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;
Abstract
The conductive paste contains the following dispersed in a binder resin dissolved in a solvent: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide-comprising powder. The oxide contains vanadium with a valence no greater than 4 and a glass phase. In the method for manufacturing an electronic component, the conductive paste is applied to a substrate and fired, forming electrode wiring. The electronic component is provided with electrode wiring that has: a plurality of particles comprising aluminum and/or an aluminum-containing alloy; and an oxide affixing the particles to a substrate. The oxide contains vanadium with a valence no greater than 4. A compound layer containing vanadium and aluminum is formed on the surfaces of the particles, and the vanadium in the compound layer includes vanadium with a valence no greater than 4. This results in an electrode wiring with high reliability and water resistance.