The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Nov. 16, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Naoya Hirata, Tokyo, JP;

Takahiro Ueno, Koshi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1362 (2006.01); G02F 1/1345 (2006.01); G02F 1/1333 (2006.01); G02F 1/1368 (2006.01); G02F 1/1343 (2006.01); G02F 1/1339 (2006.01);
U.S. Cl.
CPC ...
G02F 1/136286 (2013.01); G02F 1/1339 (2013.01); G02F 1/1368 (2013.01); G02F 1/13439 (2013.01); G02F 1/133345 (2013.01); G02F 1/134363 (2013.01); G02F 1/136227 (2013.01); G02F 2201/123 (2013.01);
Abstract

A liquid crystal display device includes: a first substrate which includes a display region, in which scan wirings and signal wirings intersecting with scan wirings are formed, and a frame region, which surrounds the display region, wherein a lead-out wiring extending from at least one of the signal wiring and the scan wiring and a ground electrode on an insulating layer covering the lead-out wiring are formed in the frame region; a second substrate, which faces the first substrate with interposing a seal, wherein a transparent conductive film is formed on a surface opposite to a side where the liquid crystal is provided; and a conductive member, which is formed to extend across the first substrate and the second substrate to electrically connect the transparent conductive film with the ground electrode, wherein the ground electrode overlaps with at least one of the lead-out wirings.


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