The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
May. 07, 2014
Henkel (China) Company Limited, Shanghai, CN;
Rui Zhang, Shanghai, CN;
Daoqiang Lu, Shanghai, CN;
Henkel AG & Co. KGaA, Duesseldorf, DE;
Abstract
The present invention provides a dual-curable adhesive composition, comprising: component (a): an epoxy resin; at least one selected from component (b) and component (c), wherein component (b) is a (meth)acrylate monomer, and component (c) is an oligomer containing a (meth)acryloxy group; component (d): a thermal polymerization catalyst which catalyzes the thermal polymerization reaction of component (a); and component (e): a photo polymerization initiator which initiates the photo polymerization reaction of component (a) and at least one selected from component (b) and component (c), wherein component (e) is a mixture of a cationic photo polymerization initiator and a radical photo polymerization initiator. The dual-curable adhesive composition of the present invention is used for bonding or laminating a transparent substrate with another transparent substrate, or bonding or laminating a transparent substrate with a non-transparent substrate. The present invention also provides a process for bonding substrates.