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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9783681 B1

PDFFull Text
Expired
Date of Patent:
Oct. 10, 2017

Filed:

Oct. 21, 2010

Solventless functionalization, milling, and compounding process with reactive diluents

Applicants:

Peter D. Condo, Lake Elmo, MN (US);

Jung-sheng Wu, Woodbury, MN (US);

Chad A. Haraldson, Apple Valley, MN (US);

William J. Schultz, North Oaks, MN (US);

Emily S. Goenner, Shoreview, MN (US);

James E. Thorson, Hudson, WI (US);

Wendy L. Thompson, Roseville, MN (US);

Inventors:

Peter D. Condo, Lake Elmo, MN (US);

Jung-Sheng Wu, Woodbury, MN (US);

Chad A. Haraldson, Apple Valley, MN (US);

William J. Schultz, North Oaks, MN (US);

Emily S. Goenner, Shoreview, MN (US);

James E. Thorson, Hudson, WI (US);

Wendy L. Thompson, Roseville, MN (US);

Assignee:

3M Innovative Properties Company, St. Paul, MN (US);

Attorneys:

Philip P. Soo

Thomas M. Spielbauer

Primary Examiner:

Randy Gulakowski

Assistant Examiner:

Ha S Nguyen

Int. Cl.
CPC ...
C09C 1/02 (2006.01); C09C 3/04 (2006.01); C09C 3/08 (2006.01); C08J 3/20 (2006.01); C08K 3/26 (2006.01); C08K 5/42 (2006.01); C08K 5/51 (2006.01); C08K 5/521 (2006.01); C08K 5/5317 (2006.01); B82Y 30/00 (2011.01); C01F 11/18 (2006.01);
U.S. Cl.
CPC ...
C09C 1/021 (2013.01); B82Y 30/00 (2013.01); C08J 3/203 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01); C08J 2367/06 (2013.01);
Abstract

Methods of compounding nanoparticles with a resin, e.g., a curable resin and one or more surface modifying agents are described. The methods use wet milling technology, including both continuous and batch milling processes, and can be used to functionalize the nanoparticles and disperse the functionalized nanoparticles into the resin system in a single process. Methods of compounding curable resin systems containing reactive diluents are also disclosed.

Find Patent Forward Citations

Condo, Peter. (2017). Solventless functionalization, milling, and compounding process with reactive diluents (U.S. Patent No. 9783681). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9783681

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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