The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Jun. 23, 2014
Applicant:

The United States of America, As Represented BY the Administrator of the National Aeronautics and Space Administration, Washington, DC (US);

Inventors:

Ya-Ping Sun, Clemson, SC (US);

John W. Connell, Yorktown, VA (US);

Lucia Monica Veca, Curtea de Arges, RO;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08K 9/00 (2006.01); C01B 31/04 (2006.01); C09K 5/14 (2006.01); C08K 5/14 (2006.01); B82Y 30/00 (2011.01); C08K 3/04 (2006.01); C08K 9/04 (2006.01);
U.S. Cl.
CPC ...
C01B 31/0415 (2013.01); B82Y 30/00 (2013.01); C01B 31/0423 (2013.01); C08K 3/04 (2013.01); C08K 5/14 (2013.01); C08K 9/04 (2013.01); C09K 5/14 (2013.01); C08K 2201/011 (2013.01);
Abstract

Disclosed are methods for forming carbon-based fillers as may be utilized in forming highly thermal conductive nanocomposite materials. Formation methods include treatment of an expanded graphite with an alcohol/water mixture followed by further exfoliation of the graphite to form extremely thin carbon nanosheets that are on the order of between about 2 and about 10 nanometers in thickness. Disclosed carbon nanosheets can be functionalized and/or can be incorporated in nanocomposites with extremely high thermal conductivities. Disclosed methods and materials can prove highly valuable in many technological applications including, for instance, in formation of heat management materials for protective clothing and as may be useful in space exploration or in others that require efficient yet light-weight and flexible thermal management solutions.


Find Patent Forward Citations

Loading…