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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9783412 B1

PDFFull Text
Date of Patent:
Oct. 10, 2017

Filed:

Jan. 29, 2015

Method for improving manufacturability of cavity packages for direct top port mems microphone

Applicant:

Unisem (M) Berhad, Kuala Lumpur, MY;

Inventors:

Junhua Guan, Chengdu, CN;

Ming Xiang Tang, Chengdu, CN;

Alan Evans, Bristol, GB;

Assignee:

Unisem (M) Berhad, Kuala Lumpur, MY;

Attorneys:

Wiggin and Dana LLP

Gregory S. Rosenblatt

Primary Examiner:

Huyen D Le

Int. Cl.
CPC ...
H04R 25/00 (2006.01); B81B 7/00 (2006.01); H04R 23/00 (2006.01); H04R 1/04 (2006.01); H04R 19/04 (2006.01); G01L 9/00 (2006.01); H04R 19/00 (2006.01); H04S 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0077 (2013.01); B81B 7/0061 (2013.01); G01L 9/0073 (2013.01); H04R 1/04 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 23/006 (2013.01); H04S 7/00 (2013.01); B81B 2201/0257 (2013.01); H04R 2201/003 (2013.01); H04S 2420/01 (2013.01);
Abstract

A MEMS device for use in some embodiments in a microphone or pressure sensor and method of making the same wherein a portion of the package surrounding the acoustic port is deformed either away from, towards, or both away from and towards the interior of the package. By providing this raised area proximate the acoustic port, external debris is less likely to enter the acoustic port and damage the fragile MEMS die. Further, internal attachment material holding the MEMS die to the inside of the package is prevented by flowing into and obscuring the acoustic port. The advantages of this design include longer operation lifetimes for the MEMS device, greater design freedom, and increases in production yield.

Find Patent Forward Citations

Guan, Junhua. (2017). Method for improving manufacturability of cavity packages for direct top port mems microphone (U.S. Patent No. 9783412). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9783412

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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