The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2017

Filed:

Jun. 24, 2016
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Shigeru Akimoto, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65G 47/52 (2006.01); B65G 11/20 (2006.01); B65G 47/19 (2006.01); H05K 13/02 (2006.01); H01G 13/00 (2013.01); B65G 69/16 (2006.01);
U.S. Cl.
CPC ...
B65G 47/52 (2013.01); B65G 11/203 (2013.01); B65G 47/19 (2013.01); H01G 13/00 (2013.01); H05K 13/028 (2013.01); B65G 69/16 (2013.01); B65G 2207/28 (2013.01); B65G 2814/0205 (2013.01);
Abstract

A fall impact reducing apparatus for reducing an impact on a falling chip component includes a wire assembly which is formed by stacking a plurality of wire jigs. The wire jig includes a plurality of wires arranged parallel to each other at intervals which allows the chip component C to pass through the wire jig, and the wire jig is formed of an integral body by working a base material having a predetermined thickness, the integral body constituted of a pair of frame portions and the plurality of wires extending parallel to each other between the frame portions. When the chip component is made to fall on the wire assembly, the chip component collides with the wire of any one of wire jigs.


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