The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
May. 27, 2014
Applicant:
The Boeing Company, Seal Beach, CA (US);
Inventors:
Kristin L. Krieg, Sammamish, WA (US);
Kay Y. Blohowiak, Issaquah, WA (US);
Assignee:
THE BOEING COMPANY, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F02M 35/10 (2006.01); B32B 37/14 (2006.01); B32B 37/24 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); B32B 15/08 (2006.01); B32B 15/092 (2006.01); B32B 15/095 (2006.01); B32B 7/12 (2006.01); B29C 45/14 (2006.01); B29L 31/30 (2006.01); B29L 31/00 (2006.01); B29K 71/00 (2006.01); B64D 45/02 (2006.01); F16B 11/00 (2006.01);
U.S. Cl.
CPC ...
B32B 37/144 (2013.01); B29C 45/14311 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/092 (2013.01); B32B 15/095 (2013.01); B32B 37/12 (2013.01); B32B 37/24 (2013.01); B32B 38/004 (2013.01); B29K 2071/00 (2013.01); B29L 2031/3002 (2013.01); B29L 2031/7288 (2013.01); B32B 2037/1253 (2013.01); B32B 2038/0076 (2013.01); B32B 2250/03 (2013.01); B32B 2309/025 (2013.01); B32B 2311/00 (2013.01); B32B 2363/00 (2013.01); B32B 2398/20 (2013.01); B32B 2605/18 (2013.01); B64D 45/02 (2013.01); F16B 11/006 (2013.01); Y10T 428/31529 (2015.04); Y10T 428/31605 (2015.04); Y10T 428/31678 (2015.04); Y10T 428/31681 (2015.04);
Abstract
A method for bonding components is provided. The method includes preparing a surface of a metal component, applying a film adhesive to the prepared surface, forming a thermoplastic component using injection molding such that the film adhesive is positioned between the metal component and the thermoplastic component, and curing the film adhesive.