The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
May. 09, 2013
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 1/16 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 1/186 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/97 (2013.01); H05K 1/0298 (2013.01); H05K 1/0366 (2013.01); H05K 1/115 (2013.01); H05K 3/305 (2013.01); H05K 3/4602 (2013.01); H01L 21/486 (2013.01); H01L 23/3135 (2013.01); H01L 23/49827 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/2402 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/8314 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H05K 1/185 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10984 (2013.01); Y02P 70/613 (2015.11);
Abstract
Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.