The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Aug. 16, 2013
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/042 (2006.01); H01R 43/048 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01); H05K 3/30 (2006.01); G02F 1/13 (2006.01);
U.S. Cl.
CPC ...
H01R 43/048 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/743 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H05K 3/301 (2013.01); H05K 3/323 (2013.01); G02F 1/1303 (2013.01); H01L 24/29 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32105 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/756 (2013.01); H01L 2224/759 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/75621 (2013.01); H01L 2224/75701 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75755 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83132 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H05K 2203/0278 (2013.01); Y10T 29/4914 (2015.01); Y10T 29/53174 (2015.01);
Abstract
While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.