The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Oct. 19, 2015
Applicant:
Conversant Intellectual Property Management Inc., Ottawa, CA;
Inventor:
Peter B. Gillingham, Ottawa, CA;
Assignee:
CONVERSANT INTELLECTUAL PROPERTY MANAGEMENT INC., Ottawa, CA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 25/065 (2006.01); G11C 5/02 (2006.01); G11C 5/06 (2006.01); H01L 23/48 (2006.01); H01L 23/544 (2006.01); H01L 21/02 (2006.01); H01L 21/82 (2006.01); H03K 17/00 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G11C 5/02 (2013.01); G11C 5/06 (2013.01); H01L 21/02697 (2013.01); H01L 21/82 (2013.01); H01L 23/481 (2013.01); H01L 23/544 (2013.01); H01L 24/03 (2013.01); H03K 17/00 (2013.01); H01L 23/5286 (2013.01); H01L 24/16 (2013.01); H01L 2223/5444 (2013.01); H01L 2223/54433 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06181 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/01055 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/14 (2013.01);
Abstract
In an integrated circuit (IC) adapted for use in a stack of interconnected ICs, interrupted through-silicon-vias (TSVs) are provided in addition to uninterrupted TSVs. The interrupted TSVs provide signal paths other than common parallel paths between the ICs of the stack. This permits IC identification schemes and other functionalities to be implemented using TSVs, without requiring angular rotation of alternate ICs of the stack.