The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2017
Filed:
Oct. 16, 2015
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package may include a first semiconductor chip having a plurality of first bonding pads arranged at a first pitch on a first active surface. The semiconductor package may include one or more reconfigurable package units each including a second semiconductor chip having a plurality of second bonding pads arranged at a second pitch on a second active surface; a semiconductor chip connector arranged spaced apart from the second semiconductor chip and having a plurality of through vias arranged at the first pitch; a molding layer surrounding side surfaces of the second semiconductor chip and the semiconductor chip connector; and redistribution lines formed over the second semiconductor chip, the semiconductor chip connector, and the molding layer. The semiconductor package may include coupling members interposed between the first bonding pads of the first semiconductor chip and the through vias of the reconfigurable package unit and between the respective through vias of the stacked reconfigurable package units.